B17基板接合装置
Wafer Bonder
| 装置仕様 | |
| General Bonding Capability | For aligned and unaligned wafers,substrates and chips also for triple and multiple stacks using thermo-compression,anodic,fusion,adhesive or any related bond technology |
| Wafer and Substrate Size | 150 and 100 mm Φ |
| Aligned Bonding | Down to 3 μm bond accuracy depending on processconditions |
| 設置場所 |
| 総合研究6号館 イエロールーム |
| 装置利用料金 |
| こちらをご覧ください。 |